light sensor (ams1, 3) types packing quantity: tape and reel package smd type: inner 3,000 pcs., outer 3,000 pcs. tape and reel pckage through-hole type: inner 2,000 pcs., outer 2,000 pcs. baggage package through-hole type: inner 500 pcs., outer 1,000 pcs. note*: ev = 100 lx (fluorescent lamp is used as light source) tape package is the standard packing style. please inquire if you need tape and reel packaging that allows the smd type to be picked from the 2/3-pin side. ratings 1. absolute maximum ratings (ambient temperature: 25 c 77 f ) 2. recommended operating condition cadmium-free sensor with spectral response the through-hole type for easy implementation as a cds cell replacement light sensor photo current part no. tape and reel package tape and reel package baggage package smd type (picked from the 1/4-pin side) through-hole type 260 a* ams104y AMS302t AMS302 item symbol ams104/AMS302 remarks reverse voltage v r 0.5 to 8 v photocurrent i l 5 ma power dissipation p 40 mw operating temperature t opr 30 to +85 c 22 to +185 f non-condensing at low temperatures storage temperature t stg 40 to +100 c 40 to +176 f non-condensing at low temperatures item symbol ams104/AMS302 remarks reverse voltage minimum v r 1.5 v maximum 6 v smd type through-hole type features 1. built-in optical lter for spectral response similar to that of the human eye. peak sensitivity wavelength is 580 nm 2. photocurrent is proportional to illumination. (linear output) high photocurrent is achieved by built-in photocurrent amp. i l = 260 a (typical) ev = 100 lx ( orescent light) 3. uses environmentally friendly silicon chips. 4. lead-free. 5. operates on 1.5 to 6 v dc, which is suitable for battery operation. 6. compact, smd package same through-hole shape as cds cell. typical applications 1. brightness detection for lcd backlight control for lcd devices (mobile phones, lcd tvs, car navigation systems, mobile pcs, and pdas). 2. brightness detection for controlling the keypad backlight in mobile phones. 3. brightness detection for circuits in household lighting, crime prevention lighting, and automatic lighting for bicycle. 4. brightness detection for wall clocks (radio clocks). amplifier l 2.0mm .079inch w 3.2mm .126inch h 1.0mm .039inch 14 23 34 cathode 12 anode 1 amplifier 2 2 cathode 1 anode rohs directive compatibility information http://www.nais-e.com/ 500 600 700 800 900 1000 1100 400300 0 0.2 0.4 0.6 0.8 1.0 napica spectral human spectral relative sensitivity wavelength, nm 5.0 mm dia. .197 inch dia. (surface of resin) all rights rese r v ed c o p y r i gh t matsushita elect r ic w o r k s , ltd.
light sensor (ams1, 3) 3. electrical and optical characteristics (ambient temperature: 25 c 77 f ) * 1 fluorescent lamp is used as light source. ev = brightness * 2 cie standard illuminant a is used as light source. * 3 measuring method for switching time. reference data item symbol ams104/AMS302 condition peak sensitivity wavelength p 580 nm photocurrent 1 minimum i l1 9.1 a v r = 5 v e v = 5 lx* 1 typical 13 a maximum 16.9 a photocurrent 2 minimum i l2 182 a v r = 5 v e v = 100 lx* 1 typical 260 a maximum 338 a photocurrent 3 typical i l3 500 a v r = 5 v e v = 100 lx* 2 dark current maximum i d 0.3 a v r = 5 v switching time rise time typical t r 8.5 ms v r = 2.5 v, v o = 2.5 v r l = 5 k ? fall time typical t f 8.5 ms white led i f i f r l v 0 v 0 5.0v ams104/AMS302 2.5v tftr 90% 10% 1. power dissipation vs. ambient temperature characteristics 2. relative sensitivity vs. wavelength characteristics ambient temperature: 25 c 77 f reverse voltage: 5v 3. dark current vs. ambient temperature characteristics reverse voltage: 5v 0204060 8085 100 0 10 20 30 40 50 ambient temperature, c power dissipation, mw 500 600 700 800 900 1000 1100 400300 0 0.2 0.4 0.6 0.8 1.0 napica spectral human spectral relative sensitivity wavelength, nm 40 60 1008020 0.01 0.1 1 10 0.001 dark current, a ambient temperature, c 4. photocurrent vs. brightness characteristics light source: fluorescent lamp, cie standard a reverse voltage: 5v, ambient temperature: 25 c 77 f 5. relative photocurrent vs. ambient temperature characteristics light source: fluorescent lamp, brightness: 100 lx reverse voltage: 5v 6. relative photocurrent vs. reverse voltage characteristics light source: fluorescent lamp, brightness: 100 lx ambient temperature: 25 c 77 f 10 100 1000010001 10 100 1000 10000 1 fluorescent lamp cie standard a brightness, lx photocurrent, a 0 20 40 20 40 60 80 100 0.6 0.8 1.0 1.2 1.4 relative photocurrent ambient temperature, c 32 01 45678 0 0.2 0.4 0.6 0.8 1.0 1.2 reverse voltage, v relative photocurrent all rights rese r v ed c o p y r i gh t matsushita elect r ic w o r k s , ltd.
light sensor (ams1, 3) dimensions mm inch 7. switching time vs. resistive load characteristics light source: white led, reverse voltage: 2.5v resistive load voltage: 2.5v ambient temperature: 25 c 77 f 1010.1 100 0.1 1 10 100 rise time fall time switching time, ms resistive load, k ? 1. smd type 12 3 4 2.0 .079 1.27 .050 0.3 .012 0.3 .012 1.0 .039 0.05 .002 2.2 .087 3.2 .126 0.25 .010 0.25 .010 (0.1) (.004) (0.2) (.008) 1 anode: 2 anode: 3 cathode: + 4 cathode: + detection area terminal thickness: t=0.125 general tolerance: 0.1 .004 recommended mounting pad (top view) tolerance: 0.1 .004 2.8 .110 0.8 .031 0.6 .024 1.27 .050 2. through-hole type 2 1 1 anode: 2 cathode: + detection area 5.0 0.2 dia. .197 .008 dia. 5.8 dia. .228 dia. (0.17) (.007) (1.0) (.039) (2.5) (.098) 2- 0.5 2- .020 (2.54) (.100) (1.0) (.039) 4.3 0.2 .169 .008 34 3 1.339 .118 9.1 .358 max. 1.5 max. .059 max. 1.0 max. .039 1.0 .039 general tolerance: 0.5 .020 all rights rese r v ed c o p y r i gh t matsushita elect r ic w o r k s , ltd.
light sensor (ams1, 3) safety precautions cautions for use be sure to obey the following in order to prevent injuries and accidents. do not use the sensors under conditions that exceed the range of its speci cations. it may cause overheating, smoke, or re. connect terminals correctly by verifying the pin layout with the speci cations diagram or other instructions. erroneous connections may lead to unexpected operating errors, overheating, smoke, or re. for an impotant and serious application in terms of safety, add protection circuit or any other protection method. 1. applying stress that exceeds the absolute maximum rating if the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. in extreme cases, wiring may melt, or silicon p/n junctions may be destroyed. as a result, the design should ensure that the absolute maximum ratings will never be exceeded, even momentarily. 2. deterioration and destruction caused by discharge of static electricity this phenomenon is generally called static electricity destruction. static electricity generated by various factors ows through the terminal and occurs to destroy internal elements. to prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) employees handling sensor should wear anti-static clothing and should be grounded through protective resistance of 500 k ? to 1 m ? . 2) a conductive metal sheet should be placed over the work table. measuring instruments and jigs should be grounded. 3) when using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (use of low- voltage soldering irons is also recommended.) 4) devices and equipment used in assembly should also be grounded. 5) when packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) when storing or transporting sensor, the environment should not be generated static electricity (for instance, the humidity should be between 45 and 60%), and sensor should be protected using conductive packing materials. 3. just after supplying voltage, please note that current in the sensor will be not constant until internal circuit stability. 4. storage the sensors are transparent plastic packages. they are sensitive to moisture and come in moisture-proof packages. observe the following cautions when storing. 1) after the moisture-proof package is unsealed, take the sensors out of storage as soon as possible (within 1 week at the most). 2) if the devices are to be left in storage for a considerable period after the moisture-proof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). 3) storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. the following storage conditions are recommended: temperature: 0 to 30 c 32 to 86 f humidity: less than 60% r.h. (avoid freezing and condensing) atomosphere: no harmful gasses such as sulfurous acid gas, minimal dust. *when mounting with solder, if thermal stress is applied to sensors that have absorbed moisture, the moisture will vaporize, swelling will occur, and the inside of the package will become stressed. this may cause the package surface to blister or crack. therefore, please take caution and observe the soldering conditions in the following section. 5. recommended soldering conditions 1) recommended condition (1) ir (infrared re ow) soldering method t 1 = 155 to 180 c 311 to 356 f t 2 = 230 c 446 f t 3 = 250 c 482 f or less t 1 = 60 to 120 s or less t 2 = 30 s or less (2) soldering iron method tip temperature: 350 to 400 c 662 to 752 f wattage: 30 to 60 w soldering time: within 3 s 2) do not do ow soldering. 1) recommended condition (1) double wave soldering method t 1 = 120 c 248 f t 2 = 260 c 500 f or less t 1 = 120 s or less t 2 +t 3 = 6 s or less (2) soldering iron method tip temperature: 350 to 400 c 662 to 752 f wattage: 30 to 60 w soldering time: within 3 s 2) the soldered position on leads should not be closer than 3mm .118inch to the molding resin of this sensor. 6. notes for mounting 1) temperature rise in the lead portion is highly dependent on package size. if multiple different packages are mounted on the same board, please check your board beforehand in an actual product, ensuring that the temperature of the solder area of the sensor terminals falls within the temperature conditions of item 5. 2) if the mounting conditions exceed the recommended solder conditions in item 5, resin strength will fall and the mismatching of the heat expansion coef cient of each constituent material will increase markedly, possibly causing cracks in the package, disconnections of bonding wires, and the like. for this reason, please inquire with us about whether this use is possible. t 1 t 2 t 3 t 1 t 2 t 1 t 2 t 1 t 2 t 3 all rights rese r v ed c o p y r i gh t matsushita elect r ic w o r k s , ltd.
light sensor (ams1, 3) 11. the following shows the packaging format 1) smd type tape and reel mm inch 2) through-hole type tape and reel mm inch type tape dimensions dimensions of tape reel light sensor napica smd type ams104y note) when picked from 1 and 4-pin side: part no. ams104y (shown above) tape dimensions light sensor napica through-hole type AMS302t note) zigzag tape style is used. symbol symbol dimensions remarks feed hole pitch p 0 12.7 0.3 .500 .012 product interval pitch p 12.7 1.0 .500 .039 product distance p 2 6.35 1.3 .250 .051 product bottom distance h 20.5 1.0 .807 .039 lead interval f 2.54 0.5 .100 .020 product slant ? h 0 1.0 0 .039 product tilt ? p 0 1.0 0 .039 tape width w 18.0 .709 holding tape width w 0 13.0 0.3 .512 .012 feed hole position w 1 9.0 .354 holding tape distance w 2 0 to 0.5 0 to .020 feed hole diameter d 0 3.8 0.2 .150 .008 tape thickness t 0.5 0.2 .020 .008 included holding tape thickness l max.: 11.0 .433 7. cleaning solvents compatibility we recommend dip cleaning with an organic solvent for removal of solder ux etc. if you cannot avoid using ultrasonic cleansing, please ensure that the following conditions are met, and check beforehand for defects. frequency: 27 to 29 khz ultrasonic power: no greater than 0.25w/cm 2 cleaning time: no longer than 30 s cleanser used: asahiklin ak-225 other: submerge in solvent in order to prevent the pcb and sensors from being contacted directly by the ultrasonic vibrations. note: applies to unit area ultrasonic power for ultrasonic baths. 8. transportation extreme vibration during transport will warp the lead or damage the sensor. handle the outer and inner boxes with care. 9. avoid using the sensor in environments containing excessive amounts of steam, dust, corrosive gas, or where organic solvents are present. 10. lead forming and cutting 1) lead forming must be done at normal temperature before soldering 2) the bent and cut position on leads should not be closer than 3mm .118inch to the base of leads. 3) lead forming and cutting must be done while xing the base of leads. 4) avoid mounting with stress at the base of leads. device mounted on tape direction of picking 8.0 0.2 .315 .008 1.0 0.1 dia. .039 .004 dia. 1.5 dia. 4.0 0.1 .157 .004 2.0 0.1 .079 .004 2.4 0.1 .094 .004 4.0 0.1 .157 .004 1.75 0.1 .069 .004 3.5 0.1 .138 .004 3.6 0.1 .142 .004 1.5 0.3 .059 .012 0.2 0.05 .008 .002 + 0.1 ? 0 .059 dia. + .004 ? 0 cathode side anode side 60 0.5 dia. 2.362 .020 dia. 2.0 0.5 .079 .020 178 2 dia. 7.008 .079 dia. 11.4 1.0 .449 .039 9.0 0.3 .354 .012 21.0 0.8 dia. .827 .031 dia. 13.0 0.5 dia. .512 .020 dia. d 0 ? p ? h h l f p 2 p p 0 w w 1 w 0 w 2 anode side cathode side + 1.0 ? 0.5 + .039 ? .020 + 0.75 ? 0.5 + .030 ? .020 all rights rese r v ed c o p y r i gh t matsushita elect r ic w o r k s , ltd.
light sensor (ams1, 3) light sensor napica terminology term symbol explanation reverse voltage v r the applied voltage between the cathode and anode. photocurrent i l the current that ows between the cathode and anode when light is applied. power dissipation p the electric power loss that occurs between the cathode and anode. operating temperature t opr the workable ambient temperature range at which normal operation is possible under the condition of a prescribed allowable loss. storage temperature t stg the ambient temperature range at which the sensor can be left or stored without applying voltage. peak sensitivity wavelength p the wavelength of light at which sensitivity is at its maximum. dark current i d the current between the cathode and anode when reverse voltage is applied during darkness. rise time t r time required for the output waveform to rise from 10% to 90% when light is applied. fall time t f time required for the output waveform to fall from 90% to 10% when light is cut. all rights rese r v ed c o p y r i gh t matsushita elect r ic w o r k s , ltd.
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